XCVU9P-2FLGB2104I FPGA,VIRTEX ULTRASCALE,FCBGA-2104
Tlhahisoleseding ya Sehlahiswa
| TYPENo.ea Li-Logic Blocks: | 2586150 |
| Nomoro ea li-Macrocell: | 2586150Macrocells |
| Lelapa la FPGA: | Virtex UltraScale Series |
| Setaele sa Taba ea logic: | FCBGA |
| Nomoro ea Pins: | 2104Pins |
| Nomoro ea Mephato ea Lebelo: | 2 |
| Kakaretso ea Bits ea RAM: | 77722Kbit |
| Nomoro ea I/O's: | 778I/O's |
| Tsamaiso ea Oache: | MMCM, PLL |
| Core Supply Voltage Min: | 922mV |
| Core Supply Voltage Max: | 979mV |
| I/O Supply Voltage: | 3.3V |
| Maqhubu a ho sebetsa: | 725MHz |
| Mefuta ea Lihlahisoa: | Virtex UltraScale XCVU9P |
| MSL: | - |
Kenyelletso ea Sehlahisoa
BGA e emetseBall Grid Q Array Package.
Mehopolo e kentsoeng ke theknoloji ea BGA e ka eketsa matla a mohopolo ho fihlela makhetlo a mararo ntle le ho fetola molumo oa mohopolo, BGA le TSOP.
Ha ho bapisoa, e na le molumo o monyenyane, ts'ebetso e ntle ea ho senya mocheso le ts'ebetso ea motlakase.Theknoloji ea ho paka ea BGA e ntlafalitse haholo bokhoni ba polokelo ka lisenthimithara tse lisekoere, ho sebelisa lihlahisoa tsa mohopolo oa theknoloji ea BGA tlas'a matla a tšoanang, molumo ke karolo ea boraro feela ea liphutheloana tsa TSOP;Ho feta moo, ka moetlo
Ha ho bapisoa le sephutheloana sa TSOP, sephutheloana sa BGA se na le tsela e potlakileng le e sebetsang ea ho senya mocheso.
Ka nts'etsopele ea theknoloji e kopanetsoeng ea potoloho, litlhoko tsa ho paka tsa lipotoloho tse kopantsoeng li thata haholoanyane.Lebaka ke hore theknoloji ea ho paka e amana le ts'ebetso ea sehlahisoa, ha maqhubu a IC a feta 100MHz, mokhoa oa setso oa ho paka o ka hlahisa seo ho thoeng ke "Cross Talk• phenomenon, le ha palo ea lipini tsa IC e le teng. kholo ho feta 208 Pin, mokhoa oa khale oa ho paka o na le mathata.Ka hona, ntle le ts'ebeliso ea liphutheloana tsa QFP, boholo ba li-chips tsa kajeno tse phahameng (joalo ka li-graphics chips le chipsets, joalo-joalo) li fetoleloa ho BGA(Ball Grid Array). PackageQ) theknoloji ea ho paka.Ha BGA e hlaha, e ile ea e-ba khetho e ntle ka ho fetisisa bakeng sa liphutheloana tse phahameng haholo, tse sebetsang hantle, tse nang le li-pin tse ngata tse kang cpus le li-chips tsa borokho tse ka boroa / Leboea holim'a liboto tsa bo-'mè.
Theknoloji ea ho paka ea BGA le eona e ka aroloa ka mekhahlelo e mehlano:
1.PBGA (Plasric BGA) substrate: Ka kakaretso 2-4 le dikarolo tsa lintho tse bonahalang tse entsoeng ka boto multi-lera.Intel series CPU, Pentium 1l
Li-processor tsa Chuan IV kaofela li phuthetsoe ka foromo ena.
2.CBGA (CeramicBCA) substrate: ke hore, substrate ea ceramic, khokahano ea motlakase pakeng tsa chip le substrate hangata ke flip-chip.
Mokhoa oa ho kenya FlipChip (FC ea nakoana).Intel series cpus, Pentium l, ll Pentium Pro processors li sebelisoa
Sebopeho sa encapsulation.
3.FCBGA(FilpChipBGA) substrate: Karolo e thata ea mekhahlelo e mengata.
4.TBGA (TapeBGA) substrate: The substrate ke lente bonolo 1-2 lera PCB potoloho boto.
5.CDPBGA (Carty Down PBGA) substrate: e bua ka sebaka se tlaase sa "square chip" (se tsejoang hape e le sebaka sa cavity) bohareng ba sephutheloana.
Sephutheloana sa BGA se na le likarolo tse latelang:
1) .10 Palo ea lipini e eketsoa, empa sebaka se pakeng tsa lithapo se seholo haholo ho feta sephutheloana sa QFP, se ntlafatsang chai.
2) .Le hoja tšebeliso ea matla ea BGA e ntse e eketseha, ts'ebetso ea ho futhumatsa ea motlakase e ka ntlafatsoa ka lebaka la mokhoa o laoloang oa ho putlama ha chip welding.
3).Ho lieha ha phetisetso ea mats'oao ho nyane, 'me frequency ea adapta e ntlafalitsoe haholo.
4).Kopano e ka ba coplanar welding, e leng ho ntlafatsang ho tšepahala haholo.
