Original IC XCKU025-1FFVA1156I Chip Integrated Circuit IC FPGA 312 I/O 1156FCBGA

tlhaloso e khuts'oane:

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 13004800 318150 1156-BBGA、FCBGA

Re romelle lengolo-tsoibila Khoasolla Datesheet

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Litšobotsi tsa Sehlahisoa

MOFUTA	TS'OANELO
sehlopha	Lipotoloho tse Kopantsoeng (ICs) E kenyelelitsoe Field Programmable Gate Arrays (FPGAs)
moetsi	AMD
letoto	Kintex® UltraScale™
thatela	bongata
Boemo ba sehlahisoa	E sebetsa
DigiKey e ka khonahala	Ha e netefatsoe
Nomoro ea LAB/CLB	18180
Palo ea lintlha tsa logic/liyuniti	318150
Kakaretso ea palo ea li-bits tsa RAM	13004800
Nomoro ea I/Os	312
Voltage - Phepelo ea motlakase	0.922V ~ 0.979V
Mofuta oa ho kenya	Mofuta oa sekhomaretsi sa bokaholimo
Mocheso oa ho sebetsa	-40°C ~ 100°C (TJ)
Sephutheloana/Ntlo	1156-BBGA,FCBGA
Morekisi karolo encapsulation	1156-FCBGA (35x35)
Nomoro e kholo ea sehlahisoa	XCKU025

Litokomane & Media

MOSEBETSI MOFUTA	LINKI
Leqephe la lintlha	Lethathamo la lintlha tsa Kintex® UltraScale™ FPGA
Boitsebiso ba tikoloho	Setifikeiti sa Xiliinx RoHS Xilinx REACH211 Cert
PCN moralo/tlhaloso	Ultrascale & Virtex Dev Spec Chg 20/Dec/2016

Tlhophiso ea lintlha tsa tikoloho le tsa kantle ho naha

LEHLOKOA	TS'OANELO
Boemo ba RoHS	E lumellana le taelo ea ROHS3
Boemo ba Sensitivity ea Mongobo (MSL)	4 (lihora tse 72)
FIHLELA boemo	Ha e laoloe ke lintlha tsa REACH
ECCN	3A991D
HTSUS	8542.39.0001

Kenyelletso ea Sehlahisoa

FCBGA(Flip Chip Ball Grid Array) e emetse "flip chip ball grid Array".

FC-BGA(Flip Chip Ball Grid Array), e bitsoang flip chip ball grid array package, hape ke mofuta oa bohlokoa ka ho fetesisa oa li-chips tsa ho potlakisa litšoantšo hajoale.Theknoloji ena ea ho paka e qalile lilemong tsa bo-1960, ha IBM e ne e hlahisa theknoloji e bitsoang C4 (Controlled Collapse Chip Connection) bakeng sa ho kopanya lik'homphieutha tse kholo, 'me e tsoela pele ho sebelisa tsitsipano ea holim'a leqhubu le qhibilihisitsoeng ho tšehetsa boima ba chip. le ho laola bophahamo ba leqhubu.'Me e be tataiso ea nts'etsopele ea theknoloji ea flip.

Melemo ea FC-BGA ke efe?

Ea pele, e rarollaho lumellana ha motlakase(EMC) letšitiso ea motlakase (EMI)mathata.Ka kakaretso, phetiso ea pontšo ea chip e sebelisang theknoloji ea ho paka ea WireBond e etsoa ka terata ea tšepe e nang le bolelele bo itseng.Tabeng ea maqhubu a phahameng, mokhoa ona o tla hlahisa seo ho thoeng ke phello ea impedance, ho etsa tšitiso tseleng ea pontšo.Leha ho le joalo, FC-BGA e sebelisa li-pellets ho e-na le lithapo ho hokela processor.Sephutheloana sena se sebelisa kakaretso ea libolo tse 479, empa e 'ngoe le e' ngoe e na le bophara ba 0.78 mm, e fanang ka sebaka se khuts'oane sa khokahanyo ea kantle.Ho sebelisa sephutheloana sena ha ho fane feela ka ts'ebetso e ntle ea motlakase, empa hape ho fokotsa tahlehelo le inductance lipakeng tsa likhokahano tsa likarolo, ho fokotsa bothata ba ho kena-kenana le motlakase, 'me ho khona ho mamella maqhubu a phahameng, ho tlola moeli oa overclocking hoa khoneha.

Ea bobeli, ha baetsi ba li-chips ba ntse ba kenyelletsa lipotoloho tse teteaneng le ho feta sebakeng se le seng sa silicon crystal, palo ea li-terminals le li-pins tsa ho kenya li tla eketseha ka potlako, 'me molemo o mong oa FC-BGA ke hore o ka eketsa boholo ba I / O. .Ka kakaretso, li-I/O li etella pele ho sebelisa theknoloji ea WireBond li hlophisitsoe ho pota-potile chip, empa ka mor'a sephutheloana sa FC-BGA, tataiso ea I / O e ka hlophisoa ka mokhoa o mongata holim'a chip, e fana ka tekanyo e phahameng ea I / O. tlhophiso, e hlahisang ts'ebeliso e ntle ka ho fetisisa, le ka lebaka la molemo ona.Theknoloji ea inversion e fokotsa sebaka seo ka 30% ho isa ho 60% ha e bapisoa le mefuta e tloaelehileng ea ho paka.

Qetellong, molokong o mocha oa li-chips tse bonts'ang ka lebelo le phahameng, tse kopantsoeng haholo, bothata ba ho senya mocheso e tla ba phephetso e kholo.Ho ipapisitsoe le mofuta o ikhethileng oa sephutheloana sa FC-BGA, bokamorao ba chip bo ka pepeseha moeeng 'me bo ka ntša mocheso ka kotloloho.Ka nako e ts'oanang, substrate e ka boela ea ntlafatsa katleho ea mocheso oa mocheso ka lera la tšepe, kapa ea kenya mocheso oa mocheso oa tšepe ka morao ho chip, ea matlafatsa matla a ho qhala mocheso oa chip, 'me ea ntlafatsa haholo botsitso ba chip. ts'ebetsong e potlakileng haholo.

Ka lebaka la melemo ea sephutheloana sa FC-BGA, hoo e batlang e le likarete tsohle tsa karete ea ho potlakisa litšoantšo li kentsoe ka FC-BGA.

E fetileng: XC7VX485T-2FFG1761I Virtex®-7 T le XT FPGAs li fumaneha ka -3, -2, -1, le -2L lebelo la limaraka tsa RoHS Compliant

E 'ngoe: XCVU9P-2FLGB2104I FPGA,VIRTEX ULTRASCALE,FCBGA-2104

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