XC7K325T-1FBG676I 676-FCBGA (27×27) potoloho e kopanetsoeng IC FPGA 400 I/O 676FCBGA likarolo tsa elektronike
Litšobotsi tsa Sehlahisoa
MOFUTA | TLHALOSO |
Sehlopha | Lipotoloho tse Kopantsoeng (ICs)E kenyelelitsoeFPGAs (Field Programmable Gate Array) |
Mfr | AMD Xilinx |
Letoto | Kintex®-7 |
Sephutheloana | Terei |
Sephutheloana se Tloaelehileng | 1 |
Boemo ba Sehlahiswa | E sebetsa |
Palo ea li-LAB/CLBs | 25475 |
Palo ea Lintlha tsa Logic / Lisele | 326080 |
Kakaretso ea RAM Bits | 16404480 |
Nomoro ea I/O | 400 |
Voltage - Phepelo | 0.97V ~ 1.03V |
Mofuta oa ho Beha | Thaba e kaholimo |
Mocheso oa ho sebetsa | -40°C ~ 100°C (TJ) |
Sephutheloana / Taba | 676-BBGA, FCBGA |
Sephutheloana sa Sesebelisoa sa Bafani | 676-FCBGA (27×27) |
Nomoro ea Sehlahisoa sa Motheo | XC7K325 |
Ke hobane'ng ha koloi e ntse e lla ka lebaka la ho haelloa ke maqhubu a mantlha ho jara boima?
Ho tloha maemong a hajoale a phepelo ea li-chip le tlhokeho ea lefats'e, bothata ba khaello ea li-chip bo thata ho bo rarolla ka nako e khuts'oane, mme bo tla mpefala, 'me li-chips tsa likoloi ke tsona tsa pele tse jarang boima.E khetholloa ho tsoa ho lisebelisoa tsa lisebelisoa tsa motlakase tsa bareki, li-chips tsa likoloi tse sebelisoang haholo hona joale, mathata a eona a ho sebetsa a phahame, a bobeli feela ho sehlopha sa sesole, 'me bophelo ba li-chips tsa boemo ba likoloi hangata bo tlameha ho fihla lilemo tse 15 kapa ho feta, setsi sa k'hamphani ea likoloi ka har'a lichifi tse khethiloeng tsa likoloi. , 'me e ke ke ea nkeloa sebaka habonolo.
Ho tloha boemong ba 'maraka, sekhahla sa lefats'e sa likoloi tsa semiconductor ka 2020 se ka bang $46 bilione, e leng karolo ea 12% ea 'maraka oa semiconductor ka kakaretso, o monyenyane ho feta likhokahano (ho kenyeletsoa li-smartphone), PC, joalo-joalo ... e lebelletse hore sekhahla sa kholo ea kholo ea likoloi tsa likoloi tsa lefatše se ka bang 14% ka 2016-2021, se etellang pele sekhahla sa kholo likarolong tsohle tsa indasteri.
Chip ea likoloi e arotsoe hape ka MCU, IGBT, MOSFET, sensor, le likarolo tse ling tsa semiconductor.Likoloing tse tloaelehileng tsa mafura, MCU e nka karolo ea 23% ea boleng ba boleng.Likoloi tse hloekileng tsa motlakase, MCU e nka 11% ea boleng ka mor'a IGBT, chip ea semiconductor ea matla.
Joalo ka ha u bona, libapali tsa mantlha tsa chip me ea likoloi tsa lefats'e li arotsoe ka mekhahlelo e 'meli: baetsi ba likoloi ba setso le baetsi ba li-chips tsa bareki.Ka tekanyo e kholo, liketso tsa sehlopha sena sa baetsi ba lihlahisoa li tla phetha karolo ea makhaola-khang matla a tlhahiso ea lik'hamphani tsa likoloi tsa morao-rao.Leha ho le joalo, morao tjena, baetsi bana ba lihlooho ba anngoe ke liketsahalo tse fapaneng tse ammeng phepelo ea li-chips, ka mokhoa o ts'oanang e lebisang karabelong ea phepelo le tlhokeho ea teka-tekano ho pholletsa le ketane ea indasteri.
Ka la 5 November selemong se fetileng, ka mor'a qeto ea batsamaisi ba STMicroelectronics (ST) ea ho se fe basebetsi phaello ea moputso selemong sena, mekhatlo e meraro e meholo ea French ST, CAD, CFDT, le CGT, e ile ea qala seteraeke ho limela tsohle tsa French ST.Lebaka la ho phahama ha meputso le ne le amana le New Coronavirus, seoa se matla Europe ka Hlakubele selemong sena, mme karabelo ea matšoenyeho a basebetsi mabapi le ho fumana konteraka ea New Coronavirus, ST e fihletse tumellano le masela a Fora ho fokotsa tlhahiso ea feme. ka 50%.Ka nako e ts'oanang ho ile ha boela ha baka litšenyehelo tse phahameng bakeng sa thibelo le taolo ea seoa sena.
Ho phaella moo, Infineon, NXP ka lebaka la tšusumetso ea leqhubu le batang la United States, fektheri ea chip e teng Austin, Texas, ho qeta ho koala;fektheri ea Renesas Electronics Naka (Motse oa Hitachi Naka, Setereke sa Ibaraki, Japane) mollo o bakileng tšenyo e tebileng sebakeng se senyehileng ke mohala oa tlhahiso ea li-semiconductor oafer ea 12-inch, e leng tlhahiso e ka sehloohong ea li-microprocessors ho laola ho khanna koloi.Ho hakanngoa hore ho ka nka matsatsi a 100 hore tlhahiso ea chip e khutlele maemong a pele ho mollo.