Seboka sa Boraro sa Semiconductor sa 2022 se tla tšoareloa Suzhou ka la 28 Tšitoe!
Lisebelisoa tsa CMP tsa Semiconductorle Simposium ea Maikemisetso ea 2022 e tla tšoareloa Suzhou ka la 29 Tšitoe!
Ho latela webosaete ea semmuso ea McLaren, haufinyane ba kentse moreki oa OEM, mofuta oa likoloi tsa lipapali tsa mofuta oa Amerika Czinger, mme ba tla fana ka mofuta o latelang oa IPG5 800V silicon carbide inverter bakeng sa 21C supercar ea moreki, e lebelletsoeng ho qala ho tsamaisoa selemong se tlang.
Ho ea ka tlaleho, koloi ea lipapali tsa Czinger hybrid 21C e tla ba le li-inverters tse tharo tsa IPG5, 'me tlhahiso ea tlhōrō e tla fihla ho 1250 horsepower (932 kW).
E boima ba lik'hilograma tse ka tlase ho 1,500, koloi ea lipapali e tla ba le enjene ea V8 ea 2.9-litre ea twin-turbocharged e tsamaeang ho feta 11,000 rpm le ho potlakisa ho tloha 0 ho ea ho 250 mph ka metsotsoana e 27, ho phaella ho koloi ea motlakase ea silicon carbide.
Ka December 7, websaeteng ea molao ea Dana e phatlalalitse hore ba saenetse tumellano ea nako e telele ea phepelo le SEMIKRON Danfoss ho boloka matla a tlhahiso ea li-semiconductors tsa silicon carbide.
Ho tlalehoa hore Dana o tla sebelisa module ea SEMIKRON's eMPack silicon carbide mme e hlahisitse li-inverters tse mahareng le tse phahameng.
Ka February 18 selemong sena, websaeteng ea molao ea SEMIKRON e boletse hore ba saenetse konteraka le moetsi oa likoloi oa Jeremane bakeng sa li-euro tse limilione tse likete tse 10 + (li-yuan tse fetang limilione tse likete tse 10) silicon carbide inverter.
SEMIKRON e thehiloe ka 1951 e le moetsi oa Jeremane oa li-module tsa matla le litsamaiso.Ho tlalehoa hore lekhetlong lena k'hamphani ea likoloi ea Jeremane e ile ea laela sethala se secha sa motlakase sa motlakase sa SEMIKRON eMPack®.Sethala sa module sa matla sa eMPack® se ntlafalitsoe bakeng sa theknoloji ea silicon carbide 'me se sebelisa theknoloji ea "direct pressure mold" (DPD) e kentsoeng ka botlalo, ka tlhahiso ea molumo e reretsoeng ho qala ka 2025.
Dana Incorporatedke morekisi oa likoloi oa Tier1 oa Amerika ea thehiloeng ka 1904 mme ntlo-kholo ea hae e Maumee, Ohio, ka thekiso ea $ 8.9 bilione ka 2021.
Ka la 9 Tšitoe 2019, Dana o ile a hlahisa SiC inverterTM4 ea eona, e ka fanang ka li-volts tse fetang 800 bakeng sa likoloi tsa baeti le li-volts tse 900 bakeng sa likoloi tsa mabelo.Ho feta moo, inverter e na le matla a matla a 195 kilowatts ka litha e le 'ngoe, hoo e batlang e le habeli sepheo sa 2025 sa Lefapha la Matla la United States.
Mabapi le ho saena, Dana CTO Christophe Dominiak o itse: Lenaneo la rona la ho kenya motlakase le ntse le hola, re na le ts'epo e kholo ea odara (liranta tse limilione tse 350 ka 2021), 'me li-inverters li bohlokoa haholo.Tumellano ena ea phepelo ea lilemo tse ngata le Semichondanfoss e re fa monyetla oa leano ka ho netefatsa phihlello ea li-semiconductors tsa SIC.
Joalo ka lisebelisoa tsa mantlha tsa liindasteri tse ntseng li hlaha tse kang likhokahano tsa moloko o latelang, likoloi tse ncha tsa matla, le literene tse lebelo, li-semiconductors tsa moloko oa boraro tse emeloang ke silicon carbide le gallium nitride li thathamisitsoe e le lintlha tsa bohlokoa ho "Leano la 14th la Lilemo tse Hlano. ” le kemiso ea lipakane tsa nako e telele tsa 2035.
Bokhoni ba tlhahiso ea silicon carbide 6-inch wafer e nakong ea katoloso e potlakileng, ha bahlahisi ba etelletseng pele ba emeloang ke Wolfspeed le STMicroelectronics ba fihletse tlhahiso ea li-wafers tsa silicon carbide tsa 8-inch.Bahlahisi ba malapeng ba kang Sanan, Shandong Tianyue, Tianke Heda le bahlahisi ba bang haholo-holo ba tsepamisa maikutlo ho li-wafers tse 6-inch, tse nang le merero e fetang 20 e amanang le letsete la li-yuan tse fetang limilione tse likete tse 30;Likhatelo-pele tsa theknoloji ea lapeng tsa 8-inch le tsona li ntse li tsoela pele.Ka lebaka la nts'etsopele ea likoloi tsa motlakase le lisebelisoa tsa ho tjhaja, sekhahla sa kholo ea 'maraka oa lisebelisoa tsa silicon carbide se lebelletsoe ho fihla ho 30% lipakeng tsa 2022 le 2025. Substrates e tla lula e le eona ntho e ka sehloohong e fokotsang bokhoni ba lisebelisoa tsa silicon carbide lilemong tse tlang.
Lisebelisoa tsa GaN hajoale li khannoa haholo ke 'maraka oa matla a tjhajang ka potlako le 5G macro base station le millimeter wave limmaraka tse nyane tsa RF.Mmaraka oa GaN RF o lula haholo ke Macom, Intel, joalo-joalo, mme mmaraka oa motlakase o kenyelletsa Infineon, Transphorm joalo-joalo.Lilemong tsa morao tjena, likhoebo tsa malapeng tse kang Sanan, Innosec, Haiwei Huaxin, joalo-joalo li boetse li sebelisa merero ea gallium nitride ka mafolofolo.Ho feta moo, lisebelisoa tsa laser tsa gallium nitride li tsoetse pele ka potlako.Li-lasers tsa semiconductor tsa GaN li sebelisoa ho lithography, polokelo, sesole, bongaka le masimo a mang, ka thomello ea selemo le selemo ea li-unit tse ka bang limilione tse 300 le sekhahla sa kholo sa morao-rao sa 20%, mme mmaraka o lebelletsoe ho fihla ho $ 1.5 bilione ka 2026.
Seboka sa 3rd Generation Semiconductor Forum se tla tšoaroa ka la 28 Tšitoe, 2022. Likhoebo tse ngata tse etelletseng pele ka hare ho naha le kantle ho naha li nkile karolo kopanong, li tsepamisitse maikutlo holim'a liketane tsa indasteri tse holimo le tse tlase tsa silicon carbide le gallium nitride;Substrate ea morao-rao, epitaxy, theknoloji ea ho sebetsana le lisebelisoa le theknoloji ea tlhahiso;Khatelo-pele ea lipatlisiso tsa mahlale a morao-rao a li-semiconductors tse pharaletseng tse kang gallium oxide, aluminium nitride, taemane le zinc oxide e lebelletsoe.
Taba ea kopano
1. Tšusumetso ea thibelo ea chip ea US ho nts'etsopele ea li-semiconductors tsa moloko oa boraro oa China.
2. Mmaraka oa lefatše le oa Chaena oa moloko oa boraro oa semiconductor le boemo ba nts'etsopele ea indasteri
3. Phepelo ea bokhoni ba Wafer le tlhoko le menyetla ea 'maraka ea moloko oa boraro oa semiconductor
4. Chelete ea lichelete le tlhokahalo ea 'maraka bakeng sa merero ea 6-inch SiC
5. Boemo le nts'etsopele ea theknoloji ea kholo ea SiC PVT & mokhoa oa mohato oa mokelikeli
6. Ts'ebetso ea sebaka sa SiC ea 8-inch le katleho ea theknoloji
7. SiC maraka le mathata a ntshetsopele ya thekenoloji & tharollo
8. Tšebeliso ea lisebelisoa tsa GaN RF le li-modules liteishene tsa motheo tsa 5G
9. Nts'etsopele le ho kenya sebaka sa GaN 'marakeng oa ho tjhaja ka potlako
10. Theknoloji ea lisebelisoa tsa laser ea GaN le tšebeliso ea 'maraka
11. Menyetla le liphephetso bakeng sa sebaka sa lehae le theknoloji le nts'etsopele ea lisebelisoa
12. Litebello tse ling tsa ntlafatso ea semiconductor ea moloko oa boraro
Ho belisoa ha mochini oa lik'hemik'hale(CMP) ke ts'ebetso ea bohlokoa ea ho fihlela sephaphatha sa lefats'e.Ts'ebetso ea CMP e sebetsa ka tlhahiso ea silicon wafer, tlhahiso e kopaneng ea potoloho, ho paka le ho etsa liteko.Mokelikeli o hloekisitsoeng le pampiri ea ho bentša ke lisebelisoa tsa mantlha tsa ts'ebetso ea CMP, tse ikarabellang ho feta 80% ea 'maraka oa thepa ea CMP.Likhoebo tsa thepa le lisebelisoa tsa CMP tse emeloang ke Dinglong Co., Ltd. le Huahai Qingke li fumane tlhokomelo e kholo ho tsoa indastering.
Lintho tse shebiloeng ke lisebelisoa tsa mantlha tsa ho lokisoa ha lifilimi tse sebetsang, tse sebelisoang haholo ho li-semiconductors, liphanele, li-photovoltaics le masimo a mang ho fihlela mesebetsi ea conductive kapa e thibelang.Har'a lisebelisoa tse kholo tsa semiconductor, thepa e shebiloeng ke eona e hlahisoang ka ho fetisisa malapeng.Aluminium ea lapeng, koporo, molybdenum le lisebelisoa tse ling tse shebiloeng li entse tsoelo-pele, lik'hamphani tse ka sehloohong tse thathamisitsoeng li kenyelletsa Jiangfeng Electronics, Youyan New Materials, Ashitron, Longhua Technology joalo-joalo.
Lilemo tse tharo tse tlang e tla ba nako ea tsoelo-pele e potlakileng ea indasteri ea tlhahiso ea semiconductor ea China, SMIC, Huahong Hongli, Changjiang Storage, Changxin Storage, Silan Micro le likhoebo tse ling ho potlakisa katoloso ea tlhahiso, Gekewei, Dingtai Craftsman, China Resources Micro le tse ling. Likhoebo tsa mehala ea tlhahiso ea li-inch tse 12 le tsona li tla kengoa tlhahisong, tse tla tlisa tlhokahalo e kholo ea lisebelisoa tsa CMP le thepa e shebiloeng.
Tlas'a boemo bo bocha, ts'ireletso ea ketane ea phepelo ea masela a lehae e ntse e ba ea bohlokoa le ho feta, 'me ho bohlokoa ho hlaolela bafani ba thepa ba lehae ba tsitsitseng, e leng se tla tlisa menyetla e meholo ho barekisi ba malapeng.Boiphihlelo bo atlehileng ba lisebelisoa tse shebiloeng bo tla fana ka litšupiso bakeng sa nts'etsopele ea libaka tsa lisebelisoa tse ling.
The Semiconductor CMP Materials and Target Symposium 2022 e tla tšoareloa Suzhou ka la 29 Tšitoe. Seboka sena se ne se tšoaretsoe ke Asiacchem Consulting, ka bonkakarolo ba likhoebo tse ngata tse etellang pele tsa lehae le kantle ho naha.
Taba ea kopano
1. Lisebelisoa tsa CMP tsa China le pholisi ea thepa e shebiloeng le mekhoa ea 'maraka
2. Tšusumetso ea likotlo tsa US ho phepelo ea thepa ea lehae ea semiconductor
3. Lisebelisoa tsa CMP le 'maraka o reretsoeng le tlhahlobo ea bohlokoa ea khoebo
4. Semiconductor CMP polishing slurry
5. Letlapa la ho bentša la CMP le nang le mokelikeli o hloekisang
6. Tsoelo-pele ea lisebelisoa tsa ho bentša tsa CMP
7. Semiconductor sepheo sa phepelo ea 'maraka le tlhoko
8. Mekhoa ea likhoebo tsa mantlha tsa semiconductor
9. Khatelo-pele ho CMP le thekenoloji ea sepheo
10. Boiphihlelo le boits'oaro ba sebaka sa lisebelisoa tse shebiloeng
Nako ea poso: Jan-03-2023