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Lethathamo le qaqileng la taolo: melaoana e mecha ea Dutch chip e ama mefuta efe ea DUV?

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Tibco News, June 30, 'muso oa Madache o ile oa fana ka melao ea morao-rao mabapi le taolo ea ho romela thepa ea thepa ea semiconductor, mecha e meng ea litaba e hlalositse sena e le taolo ea photolithography khahlanong le Chaena e boetse e nyolohela ho DUV eohle.Ebile, melaoana ena e mecha ea taolo ea kantle ho naha e shebane le theknoloji e tsoetseng pele ea 45nm le ka tlase ho chip, ho kenyeletsoa lisebelisoa tsa morao-rao tsa ALD tsa ho beha athomo, lisebelisoa tsa kholo ea epitaxial, lisebelisoa tsa plasma deposition le sistimi ea qoelisoa ea metsi, hammoho le theknoloji, software e sebelisitsoeng. ho sebelisa le ho nts'etsapele lisebelisoa tse joalo tse tsoetseng pele.

Polelong e eang ho Tibco, ASML e hatelletse hore melaoana e mecha ea taolo ea kantle ho naha ea Dutch e akaretsa feela tse ling tsa mefuta ea morao-rao ea DUV, ho kenyeletsoa TWINSCAN NXT:2000i le lits'ebetso tse latelang tsa ho qoelisoa tsa metsi.EUV lithography e ne e thibetsoe pele, 'me thomello ea litsamaiso tse ling ha e laoloe ke mmuso oa Madache.Ho latela tlhaiso-leseling ea semmuso ea ASML, sistimi ea DUV immersion lithography, ho kenyelletsa le: TWINSCAN NXT:2050i, NXT:2050i, NXT:1980Di mochini oa lithography tse tharo, tsena li ka etsa 38nm ~ 45nm process wafer process.

 

Ntle le moo, mechini e omileng ea DUV lithography e khonang ho sebetsa ka holimo ho 45nm, joalo ka ts'ebetso ea 65nm ~ 220nm, joalo ka TWINSCAN XT: 400L, XT:1460K, NXT:870, joalo-joalo, ha e kenyellelitsoe lethathamong la likotlo tsa maDutch.

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Lethathamo la taolo ea Madache, joalo ka ha le fetoletsoe ke Tibco, le tjena:

Regulation MinBuza.2023.15246-27 e fanoeng ke Letona la Khoebo ea Kantle ho Tšebelisano le Tšebelisano ea Ntšetso-pele ea Netherlands e fana ka litlhoko tsa laesense bakeng sa thomello ea thepa e tsoetseng pele ea tlhahiso bakeng sa li-semiconductors tse sa boleloang pejana ho Annex I ea Molao oa No. 2021/821 (tse amanang le semiconductor e tsoetseng pele lisebelisoa tsa tlhahiso)

Athikele ea 2: Molawana ona o thibela ho romelwa ha thepa e tsoetseng pele ya tlhahiso ya semiconductor ho tswa Netherlands ntle le tumello ya Letona.

Athikele ea 3:

1. Kopo ea tumello e boletsoeng ho Article 2 e tla etsoa ke morekisi mme e romelloe ho mochochisi.

2. Leha ho le joalo, kopo e tla ba le:

a) lebitso le aterese ea morekisi kantle ho naha;

b) Lebitso le aterese ea moamoheli le mosebelisi oa ho qetela oa lisebelisoa tse tsoetseng pele tsa tlhahiso ea semiconductor;

c) Lebitso le aterese ea moamoheli le mosebelisi oa ho qetela oa lisebelisoa tse tsoetseng pele tsa tlhahiso ea semiconductor.

3, ho sa tsotellehe boemo leha e le bofe, mochochisi o na le tokelo ea ho kopa morekisi hore a fane ka konteraka ea ho romela thepa, le polelo e mabapi le tšebeliso ea ho qetela.

Sehlooho sa 4:

Laesense e hlalositsoeng ho Article 2, e ka ipapisa le maemo le lipehelo.

Kabo ea laesense e hlalositsoeng ho Article 2 e ka ba teng ka litšoaneleho.

Article V:

Lilaesense tse boletsoeng ho Article II li ka hlakoloa maemong a latelang:

a) Laesense e fanoe ho ipapisitsoe le tlhaiso-leseling e fosahetseng kapa e sa fellang;

b) Lipehelo, maemo le lithibelo tsa laesense ha lia ka tsa lateloa;

c)Ka mabaka a leano la naha la kantle ho naha le tshireletso.

 


Nako ea poso: Jul-02-2023