EP4CGX50CF23C8N li-chips tse ncha le tsa mantlha tsa ic li-circuits tse kopaneng tsa lisebelisoa tsa elektroniki theko e ntle ka ho fetisisa sebaka se le seng reka tšebeletso ea BOM

Litšobotsi tsa Sehlahisoa

Karolelano ea litšenyehelo tsa thekiso e batla e tsitsitse, ha tekanyo ea litšenyehelo tsa R & D le tekanyo ea litšenyehelo tsa tsamaiso e ntse e fokotseha.Karolelano ea litšenyehelo tsa thekiso ea 2021, karo-karolelano ea litšenyehelo tsa tsamaiso, le karo-karolelano ea litšenyehelo tsa lichelete ke 6.66%, 4.35%, le -0.05% ka ho latellana, 'me sekhahla sa litšenyehelo tsa tsamaiso se theohile ka liperesente tse 1.7 mme sekhahla sa litšenyehelo tsa R&D se theohile ka liperesente tse 2.2 ha se bapisoa le 2020.

Karolelano ea litšenyehelo tsa R&D ea Shanghai Fudan e phahame ho feta boemo bo tloaelehileng ba indasteri.Le hoja karo-karolelano ea litšenyehelo tsa R&D ea k'hamphani e theohile lilemong tse peli tse fetileng, k'hamphani e bolokile litšenyehelo tse phahameng tsa R&D mme e maemong a holimo indastering.Matsete a tsoelang pele le a tsitsitseng a R&D a thusa ho ntlafatsa tlholisano ea mantlha ea k'hamphani le ho fumana boemo ba eona ba boetapele ba 'maraka sebakeng sa niche.Sekhahla sa litšenyehelo tsa R&D sa Shanghai Fudan se phahame haholo ho feta sa baetsi ba bang indastering, ntle le tekanyo e nyane ea lekeno la Anlu Technology, e ntseng e le mothating oa pele oa ho bapatsa lihlahisoa tsa boleng bo holimo mme e na le sekhahla se phahameng sa litšenyehelo tsa R&D. ho feta khampani.Lefapheng la moralo oa IC, o nang le litšitiso tse phahameng tsa tekheniki, lihlahisoa tse pharalletseng tsa k'hamphani li lebelletsoe ho lula li le morao-rao ebile li le teng, 'me li ka tsoela pele ho fihlela litlhoko tse fapaneng tsa mmaraka.

Sehlopha sa R&D sa Shanghai Fudan se batla se tsitsitse.Ka 2020 le 2021, basebetsi ba R&D ba k'hamphani ba tla be ba feta halofo ea palo eohle ea basebetsi;ka 2021, ho tla ba le phokotseho e nyane ea basebetsi ba R&D, e leng haholo-holo ka lebaka la tahlehelo ea basebetsi ba R&D ka lebaka la meputso e batlang e phahame ea lik'hamphani tse ling tsa lithaka.Har'a lik'hamphani tsa lithaka, palo ea basebetsi ba R & D ba Zigong SMiT le OnLu Technology e tla eketseha ka 19.5% le 24.9% selemo le selemo ho 2021. Ha ho nahanoa hore Advan Technology e tsepamisitse maikutlo ho li-chips tsa FPGA, Shanghai Fudan e lebeletsoe ho tobana le khatello ea tlhōlisano e tsoang. Ziguang SMiT le Advan Technology tšimong ea FPGA le lihlahisoa tse ling tse thibelang theknoloji e phahameng nakong e tlang.

Karolelano ea litšenyehelo tsa thekiso ea Shanghai Fudan e maemong a etelletseng pele indastering, empa ho ntse ho na le phapang ea litšenyehelo tsa thekiso ha e bapisoa le barekisi ba bang joalo ka Ziguang SMi.Karolelano ea litšenyehelo tsa thekiso ea 2021 ke 6.66%, e leng bonyane liperesente tse 2 tse holimo ho feta indasteri.Leha ho le joalo, chelete ea litšenyehelo tsa thekiso ke RMB e limilione tse 172, e ntseng e le lekhalo le itseng ha le bapisoa le RMB e limilione tse 244 ea ZTE le limilione tse 221 tsa RMB ea ZTE.Ho tloha bofelong ba 2021, Shanghai Fudan e ne e e-na le basebetsi ba 270 ba rekisang, ba ikarabellang bakeng sa 17.64% ea basebetsi ba k'hamphani, sehlopha se seholo ho feta lithaka tsa sona tsa Chaena.

2. Tlhokahalo e matla ea 'maraka bakeng sa li-FPGA tse entsoeng China,' me k'hamphani e na le monyetla oa boetapele ba theknoloji.

Li-chips tsa FPGA (Field-Programmable Gate Array) ke e 'ngoe ea makala a bohlokoa a li-logic chips, tse ipapisitseng le lisebelisoa tse ka khonehang (PAL, GAL) mme li nkile sebaka sa chip boom lilemong tsa morao tjena ka litšoaneleho tsa tsona tse ikhethang tsa ho ikamahanya le maemo. le programmability, 'me li bitsoa "universal chips"."Li-FPGA li na le melemo ea ho etsa mananeo a masimong, nako e khuts'oane ea ho ea 'marakeng, litšenyehelo tse tlase ho feta li-ASIC tse hlophisitsoeng ka botlalo, le ho ts'oana ho hoholo ho feta lihlahisoa tse sebelisoang ka kakaretso (mohlala, li-CPU).Maemong a ts'ebeliso joalo ka puisano ea 5G le bohlale ba maiketsetso, moo tsela ea theknoloji e e-so hlalosoe ka botlalo mme ho hlokahala lintlafatso tse potlakileng, li-FPGA li ka tlatselletsa li-CPU ho fana ka tharollo e nepahetseng ea sistimi.

(1) Ha e bapisoa le CPU, FPGA chip e na le monyetla o hlakileng oa ho sebelisa komporo, 'me lebelo la ts'ebetso ea litšoantšo le betere ho feta CPU,' me ha le bapisoa le GPU, FPGA e ka hlophisoa bocha mme e na le molemo o hlakileng ts'ebelisong ea matla.(2) Ha ho bapisoa le li-ASIC, li-chips tsa FPGA li na le lipotoloho tse khutšoane tsa nts'etsopele le lipotoloho tse khuts'oane tsa phallo ea li-chip, tse ka thusang lik'hamphani ho khutsufatsa nako ea tsona ho ea marakeng;Litharollo tsa ASIC li na le litšenyehelo tse tsitsitseng ha li-FPGA li batla li se na tsona, empa ha ts'ebeliso e ntse e eketseha, litharollo tsa ASIC li na le melemo e mengata ea litšenyehelo ka lebaka la moruo oa sekhahla.Ntle le moo, li-block blocks le likhokahano ka har'a li-FPGA li ka etsoa ka makhetlo a mangata ho etsa mesebetsi e fapaneng ea kelello, 'me sebopeho se hlophisitsoeng se thusa bahlahisi ho fetola mesebetsi ea chip ho etsa hore sehlahisoa se fetohe ka potlako le ho ikamahanya hantle le 5G, AI, le litlhoko tse ling tsa kopo.Ho latela data ea Frost & Sullivan, 'maraka oa China FPGA o tla hola ho tloha ho $6.56 bilione ka 2016 ho isa ho $15.03 billion ka 2020, ho CAGR ea 23.1%.Mmaraka oa China oa FPGA o lebelletsoe ho fihla ho $ 33.22 bilione ka 2025, 'me CAGR e ka bang 17% ho tloha 2020 ho isa 2025.