EP2AGX65DF25C6G li-chips tse ncha le tsa mantlha tsa ic li-circuits tse kopaneng tsa lisebelisoa tsa elektroniki theko e ntle ka ho fetisisa sebakeng se le seng reka tšebeletso ea BOM

Litšobotsi tsa Sehlahisoa

Tlaleho ea Patlisiso ea Shanghai Fudan: Moetapele oa FPGA o Tsoela Pele Kholo e Phahameng, Baetapele ba Theknoloji + Batlatsi ba Thekiso

1. Shanghai Fudan: Khampani e etelletseng pele ea IC ea China e nang le kholo e tsoelang pele e potlakileng ea li-FPGA.

E thehiloe ka 1998, Shanghai Fudan ke moetsi ea ka sehloohong oa Chaena ea shebaneng le moralo oa chip ea dijithale le tlhahlobo ea chip.Ka 1998, k'hamphani e ile ea qala khoebo ea eona ka lipotoloho tse khethehileng tsa lithelefono, lijenereithara tsa lithuthuthu le likoloi, 'me ka 1999, e ile ea hlahisa li-chips tsa karete ea memori ea 8K' me ea atleha ho thathamisoa ho Hong Kong GEM Board ka 2000. Lilemong tse hlano ka mor'a moo. lethathamong le atlehileng Hong Kong, k'hamphani e ile ea qala ka tatellano li-chips tsa likarete tse bohlale, li-MCU tsa methara ea matla, li-chips tsa RFID, le li-chips tsa SoC tsa mehala ea selefouno, e atlehileng ho kena mebarakeng ea lichelete, ea lipalangoang le ea bareki;khamphani e ile ea qala li-chips tsa taolo ea NFC bakeng sa karete ea lipalangoang tsa sechaba ka 2015. Ka 2017, lihlahisoa tsa rona tsa SLC NAND Flash le NOR Flash li fihletse katleho e habeli ho R&D le thekiso ea molumo.Ka 2020, k'hamphani e ile ea tsebisa chip ea pele ea 28nm PSoC ea China.Nakong e tlang ea phetisetso ea lehae ea lichifi tsa FPGA, Shanghai Fudan e lebelletsoe ho ba moetapele China.

Semelo sa Fudan se bohlokoa, 'me khothatso ea tekano e netefatsa botsitso ba nako e telele ba basebetsi ba mantlha ba tekheniki.Molula-setulo oa boto ea Shanghai Fudan, motlatsi oa mopresidente, moenjineri e moholo, le motlatsi oa moenjineri e moholo kaofela ba sebelitse Univesithing ea Fudan, 'me motsamaisi oa lihlahisoa le molaoli oa laboratori ea ts'ireletso le bona ba sebelitse Shanghai Fudan nako e telele.Ka hona, tsamaiso ea mantlha ea Shanghai Fudan e na le semelo se matla Univesithing ea Fudan.Litho tsa sehlopha li na le boiphihlelo bo bongata ba indasteri, boemo bo botle ba taolo, le boemo bo tebileng ba tekheniki.

Shanghai Fudan e na le likabelo tse batlang li arotsoe 'me e tšehelitsoe ke Komisi ea Naha ea Shanghai ea Tlhokomelo le Tsamaiso ea Thepa le Univesithi ea Fudan.Ho tloha ka la 30 Phuptjane 2022, kabelo e kholo ka ho fetisisa ea k'hamphani ke Shanghai Fudan Fudan Science and Technology Industry Holding Company Limited, eo 70.2% e leng ea Shanghai SASAC, hape e le kabelo ea bobeli e kholo ho Shanghai Fudan High Technology Company, eo 100% e leng ea eona. Univesithi ea Fudan.Motse-moholo o tsitsitseng le o matla oa mmuso o ralile motheo oa nts'etsopele ea k'hamphani sebakeng sa meralo ea IC e nang le litšitiso tse phahameng tsa theknoloji.Sethala sa beng ba setoko sa basebetsi se matlafatsa botsitso ba nako e telele ba lihlopha tsa botsamaisi le tsa tekheniki.Ho ea ka phatlalatso ea k'hamphani, baokameli ba hona joale ba k'hamphani ba na le kakaretso ea likarolo tse limilione tse 27.207, e leng karolo ea 3.34% ea chelete eohle ea kabelo ea k'hamphani.Khampani e na le li-platform tse 4 tsa ho arolelana likabelo tsa basebetsi, e leng Shanghai Shengteng, Shanghai Yutang, Shanghai Xuling, le Trench ea Shanghai, e nang le basebetsi ba 150 ba nkang karolo kabong ea likabelo, ba etsang 9.8% ea palo eohle ea basebetsi ba Khampani, ba tšoereng kakaretso ea limilione tse 35.172. likarolo, tse nkang karolo ea 4.32% ea kakaretso ea capital capital ea Khampani.

Khamphani e na le likhoebo tse kholo tse 5 le mela e 4 ea lihlahisoa tse kholo.Khamphani e na le mela e mene ea lihlahisoa: li-chips tsa ts'ireletso le boitsebahatso, memori e sa fetoheng, li-chips tsa meter tse bohlale, le li-gate programmable tsa masimong (FPGAs).Khamphani e thehile likamano tsa nako e telele le tse tiileng tsa tšebelisano 'moho le bahlahisi ba holimo le ba tlase khoebong ea indasteri.Lihlahisoa tsa k'hamphani li tsebisitsoe ka katleho ho Samsung, LG, VIVO, Haier, Hisense, Lenovo, le bahlahisi ba bang ba tsebahalang kantle ho China, mme lihlahisoa tsa eona tse tšepahalang joalo ka li-FPGA li amoheloa haholo ke bareki.

Lekeno la k'hamphani le tla eketseha butle-butle ho tloha ho RMB 1.424 limilione tse likete ho ea ho RMB 2.577 limilione tse likete ho 2018-2021, 'me phaello e tla ba RMB 105 milione, RMB 163 Million, RMB 133 milione, le RMB 514 milione ho tloha 2018-2021, ka ho latellana.Ka selemo sa 2019, tlholisano e ntseng e eketseha 'marakeng oa semiconductor e lebisitse ho theoheng ha litheko tsa lihlahisoa tsa k'hamphani, haholo lihlahisoa tsa polokelo, le ho theoha ha marang-rang a kopaneng le matsete a phahameng lipatlisisong le nts'etsopele ho lebisitse tahlehelong.Ho latela phatlalatso ea k'hamphani, ho qala ho qala ho hlahisoa ha li-chips tsa FPGA tse limilione tse likete tse 28 ka selemo sa 2018, kakaretso ea selemo le selemo ea thomello ea chip e amanang le FPGA e feta limilione tse 60.Ka keketseho ea indasteri le tlhoko e matla ka 2021, mela e mene ea lihlahisoa tsa k'hamphani e rekisoa hantle, 'me lekhetho le hola ka 52% selemo le selemo.

Lekeno la FPGA le mitha e bohlale ea MCU li bakile keketseho ea motsoako oa lihlahisoa.Ho latela phatlalatso ea k'hamphani, ka 2021, chelete ea k'hamphani ea FPGA chip le smart meter MCU chip e tla ba li-yuan tse limilione tse 427 le li-yuan tse limilione tse 295 ka ho latellana, e leng karolo ea 12% le 17% ea chelete eohle ea chelete ea k'hamphani, keketseho ea liperesente tse 4. Liphesente tse 6 ka ho latellana ho tloha 2018. Khampani e ntse e tsoela pele ho hlahisa lihlahisoa tsa chip tsa FPGA, 'me karolo ea eona ea chelete e ntse e eketseha.

Phaello e ntlafatsoa haholo, 'me lichifi tsa FPGA li kenya letsoho phaello e phahameng haholo.Ho latela phatlalatso ea k'hamphani, phokotseho ea phaello e kholo ka selemo sa 2019 e bakiloe haholo ke phokotseho ea phaello e kholo ea ts'ireletso le lits'oants'o tsa boitsebahatso le lihlahisoa tsa memori tse sa fetoheng, tseo, hammoho le R&D e phahameng ea k'hamphani le litšenyehelo tsa taolo, li bakileng. tahlehelong ea phaello ea selemo.Ka 2021, kakaretso ea kakaretso e fihlile ho 58.91%, e leng keketseho ea lintlha tse ka bang 13 selemo le selemo.Liphetho tsa morao-rao tsa k'hamphani tsa 2022H1 li bonts'a hore kakaretso e nyolohetse ho 65.00%.Ka sehlahisoa, FPGA le li-chips tse amanang le tsona li na le moeli o phahameng ka ho fetesisa, 'me boemo ba kakaretso bo tsitsitseng bo fetang 80% lilemong tse peli tse fetileng.Ho rua molemo ho matla a phahameng a indasteri ea semiconductor, likhahla tse felletseng tsa mela e meng e meraro ea lihlahisoa tsa k'hamphani li tla eketseha ka lintlha tse 10 ho isa ho tse 20 ka 2021 ho bapisoa le 2020.