Electronic ic chip Support BOM Service TPS54560BDDAR lisebelisoa tse ncha tsa ic chips tsa elektroniki

1.Ho reha mabitso a IC, tsebo e akaretsang ea sephutheloana le melao ea ho reha mabitso:

Boemo ba mocheso.

C=0°C ho isa ho 60°C (mophato wa kgwebo);I=-20°C ho isa ho 85°C (kereiti ea liindasteri);E=-40°C ho isa ho 85°C (kereiti e atolositsoeng ea indasteri);A=-40°C ho isa ho 82°C (mophato wa sefofane);M=-55°C ho isa ho 125°C (sehlopha sa sesole)

Mofuta oa sephutheloana.

A-SSOP;B-CERQUAD;C-TO-200, TQFP;D-Ceramic koporo holimo;E-QSOP;F-Ceramic SOP;H- SBGAJ-Ceramic DIP;K-TO-3;L-LCC, M-MQFP;N-Moqotetsane DIP;N-DIP;Q PLCC;R - Narrow Ceramic DIP (300mil);S - TO-52, T - TO5, TO-99, TO-100;U - TSSOP, uMAX, SOT;W - Wide Small Form Factor (300mil) W-Wide e nyenyane ea foromo (300 mil);X-SC-60 (3P, 5P, 6P);Y-Narrow koporo top;Z-TO-92, MQUAD;D-Die;/ PR-Polasetiki e matlafalitsoeng;/W-Wafer.

Nomoro ea lithakhisa:

a-8;b-10;c-12, 192;d-14;e-16;f-22, 256;g-4;h-4;ke -4;H-4;I-28;J-2;K-5, 68;L-40;M-6, 48;N 18;O-42;P-20;Q-2, 100;R-3, 843;S-4, 80;T-6, 160;U-60 -6,160;U-60;V-8 (ho pota);W-10 (ho pota);X-36;Y-8 (ho pota);Z-10 (ho pota).(pota).

Tlhokomeliso: Lengolo la pele la suffix ea litlhaku tse 'nè tsa sehlopha sa interface ke E, ho bolelang hore sesebelisoa se na le ts'ebetso ea antistatic.

2.Nts'etsopele ea theknoloji ea ho paka

Lipotoloho tsa pele tse kopaneng li ne li sebelisa liphutheloana tse bataletseng tsa ceramic, tse ileng tsa tsoela pele ho sebelisoa ke sesole ka lilemo tse ngata ka lebaka la ho ts'epahala le boholo ba tsona bo nyane.Liphutheloana tsa potoloho ea khoebo haufinyane li ile tsa fetohela ho liphutheloana tse peli tsa marang-rang, ho qala ka ceramic le polasetiki, 'me lilemong tsa bo-1980 palo ea lipini tsa li-circuits tsa VLSI e ile ea feta meeli ea ts'ebeliso ea liphutheloana tsa DIP, e ileng ea qetella e lebisitse ho hlaheng ha li-grid tsa pin le li-chip carriers.

Sephutheloana sa lithaba se ile sa hlaha mathoasong a lilemo tsa bo-1980 'me sa tsebahala karolong e qetellang ea lilemo tse leshome.E sebelisa sekontiri se setle haholoanyane 'me e na le sebopeho sa phini kapa sa sebopeho sa J.The Small-Outline Integrated Circuit (SOIC), mohlala, e na le sebaka se ka tlase ho 30-50% mme e tlase ka 70% ho feta DIP e lekanang le eona.Sephutheloana sena se na le lithakhisa tse bōpehileng joaloka mapheo a mapheo a tsoang mahlakoreng a mabeli a malelele le pitch ea 0.05".

Liphutheloana tsa Small-Outline Integrated Circuit (SOIC) le PLCC.lilemong tsa bo-1990, le hoja sephutheloana sa PGA se ne se ntse se sebelisoa hangata bakeng sa li-microprocessors tse phahameng.PQFP le sephutheloana se tšesaane sa kemiso e nyane (TSOP) e ile ea fetoha sephutheloana se tloaelehileng sa lisebelisoa tsa lipalo tse phahameng.Li-microprocessor tsa Intel le AMD tsa boemo bo holimo li tlohile ho liphutheloana tsa PGA (Pine Grid Array) ho ea ho liphutheloana tsa Land Grid Array (LGA).

Liphutheloana tsa Ball Grid Array li ile tsa qala ho hlaha ka bo-1970, 'me lilemong tsa bo-1990 sephutheloana sa FCBGA se ile sa etsoa ka palo e phahameng ea li-pin ho feta tse ling.Ka har'a sephutheloana sa FCBGA, dae e phethiloe holimo le tlase 'me e hokahantsoe le libolo tsa solder sephutheloana ka lera la motheo le kang PCB ho fapana le lithapo.Marakeng oa kajeno, ho paka le hona joale ke karolo e fapaneng ea ts'ebetso, 'me theknoloji ea sephutheloana e ka boela ea ama boleng le lihlahisoa tsa sehlahisoa.