Spartan®-7 Field Programmable Gate Array (FPGA) IC 250 2764800 52160 484-BBGA XC7S50-2FGGA484C likarolo tsa elektronike ic li-chips tse kopantsoeng

Litšobotsi tsa Sehlahisoa

Lintlafatso tsa morao-rao

Kamora phatlalatso ea semmuso ea Xilinx ea 28nm Kintex-7 ea pele ea lefats'e, k'hamphani e sa tsoa senola lintlha tse 'ne tsa 7 Series chips, Artix-7, Kintex-7, Virtex-7 le Zynq, le lisebelisoa tsa nts'etsopele tse potileng. ea 7 Series.

Li-FPGA tsohle tse 7 li ipapisitse le meralo e kopaneng, kaofela ka ts'ebetso ea 28nm, e fang bareki bolokolohi ba ts'ebetso ea ho fokotsa litšenyehelo le ts'ebeliso ea matla ha ba ntse ba eketsa ts'ebetso le bokhoni, ka hona ba fokotsa matsete ho nts'etsopele le phepelo ea theko e tlase le e phahameng. malapa a tshebetso.Meaho e hahiloe holim'a lelapa le atlehileng haholo la meralo ea Virtex-6 mme e etselitsoe ho nolofatsa ts'ebeliso ea litharollo tsa moralo tsa Virtex-6 le Spartan-6 FPGA ea hajoale.Mehaho e boetse e tšehetsoa ke EasyPath e netefalitsoeng.Tharollo ea phokotso ea litšenyehelo ea FPGA, e netefatsang phokotso ea 35% ntle le phetoho e ntseng e eketseha kapa matsete a boenjiniere, e ntseng e eketsa tlhahiso.

Andy Norton, CTO bakeng sa System Architecture ho Cloudshield Technologies, k'hamphani ea SAIC, o itse: "Ka ho kopanya meralo ea 6-LUT le ho sebetsa le ARM ka tlhaloso ea AMBA, Ceres e nolofalelitse lihlahisoa tsena ho tšehetsa tšebeliso ea IP hape, ho khoneha le ho tseba esale pele.Mohaho o kopaneng, sesebelisoa se secha sa processor-centric se fetolang mohopolo, le phallo ea moralo o nang le lisebelisoa tsa moloko o latelang e ke ke ea ntlafatsa haholo tlhahiso, ho feto-fetoha ha maemo, le ts'ebetso ea sistimi, empa hape e tla nolofatsa ho falla ha nako e fetileng. meloko ea meaho.Li-SOC tse matla haholoanyane li ka hahoa ka lebaka la mahlale a tsoetseng pele a ts'ebetso a lumellang tsoelo-pele e kholo tšebelisong ea matla le ts'ebetso, le ho kenyeletsoa ha hardcore processor ea A8 ho tse ling tsa lichifi.

Nalane ea ntlafatso ea Xilinx

Oct 24, 2019 - Xilinx (XLNX.US) FY2020 Q2 chelete e kenang ho 12% YoY, Q3 e lebelletsoe ho ba ntlha e tlase ho k'hamphani

La 30 Tšitoe, 2021, ho rekoa ha Ceres ka $ 35 billion ea AMD ho lebelletsoe ho koaloa ka 2022, hamorao ho feta kamoo ho neng ho reriloe pele.

Ka Pherekhong 2022, Tsamaiso e Akaretsang ea Tlhokomelo ea Maraka e nkile qeto ea ho amohela khatello ea basebelisi ka maemo a mang a lithibelo.

Ka la 14 Hlakola 2022, AMD e phatlalalitse hore e phethile ho fumana Ceres le hore litho tsa mehleng tsa boto ea Ceres Jon Olson le Elizabeth Vanderslice ba kene boto ea AMD.

Xilinx: Mathata a phepelo ea chip ea likoloi ha se feela ka li-semiconductors

Ho ea ka litlaleho tsa mecha ea litaba, US chipmaker Xilinx o lemositse hore mathata a phepelo a amang indasteri ea likoloi a ke ke a rarolloa haufinyane le hore ha e sa le taba ea tlhahiso ea semiconductor empa hape e kenyelletsa bafani ba bang ba thepa le likarolo.

Victor Peng, mopresidente, le CEO oa Xilinx o itse puisanong: "Ha se li-wafers tsa motheo feela tse nang le mathata, li-substrates tse kenyang li-chips le tsona li tobane le mathata.Hona joale ho na le mathata le likarolo tse ling tse ikemetseng. ”Xilinx ke morekisi ea ka sehloohong ho baetsi ba likoloi tse kang Subaru le Daimler.

Peng o itse o tšepa hore khaello e ke ke ea nka selemo kaofela mme Xilinx e ntse e etsa sohle se matleng a eona ho fihlela tlhoko ea bareki."Re buisana le bareki ba rona ho utloisisa litlhoko tsa bona.Ke nahana hore re etsa mosebetsi o motle oa ho fihlela litlhoko tsa bona tse tlang pele.Xilinx e boetse e sebetsa haufi-ufi le barekisi ho rarolla mathata, ho kenyeletsoa TSMC. ”

Baetsi ba likoloi tsa lefats'e ba tobane le mathata a maholo tlhahisong ka lebaka la khaello ea li-cores.Hangata li-chips li fanoa ke lik'hamphani tse kang NXP, Infineon, Renesas, le STMicroelectronics.

Ho etsa li-chip ho kenyelletsa ketane e telele ea phepelo, ho tloha ho moralo le tlhahiso ho isa ho ho paka le ho etsa liteko, 'me qetellong ho isoa lifemeng tsa makoloi.Le ha indasteri e amohetse hore ho na le khaello ea li-chips, mathata a mang a qala ho hlaha.

Lisebelisoa tsa substrate tse kang ABF (Ajinomoto build-up film) substrates, tse bohlokoa bakeng sa ho paka li-chips tse phahameng tse sebelisoang likoloing, li-server le liteishene tsa motheo, ho thoe li tobane le khaello.Batho ba 'maloa ba tloaelaneng le boemo bona ba re nako ea ho fana ka substrate ea ABF e ekelitsoe ho feta libeke tse 30.

Mookameli oa chip supply chain o itse: "Li-chips tsa bohlale ba maiketsetso le likhokahano tsa 5G li hloka ho ja ABF e ngata, 'me tlhokahalo libakeng tsena e se e le matla haholo.Keketseho ea tlhokeho ea lichifi tsa likoloi e tiisitse phepelo ea ABF.Barekisi ba ABF ba ntse ba eketsa bokhoni, empa ba ntse ba sa khone ho fihlela tlhokahalo. ”

Peng o re leha ho na le khaello ea phepelo e neng e sa lebelloa, Xilinx e ke ke ea phahamisa litheko tsa chip le lithaka tsa eona ka nako ena.Ka Tšitoe selemong se fetileng, STMicroelectronics e tsebisitse bareki hore e tla eketsa litheko ho tloha ka Pherekhong, e re "keketseho ea tlhokeho ka mor'a hore lehlabula e be ka tšohanyetso mme lebelo la ho khutla le behile ketane eohle ea phepelo tlas'a khatello."Ka la 2 Hlakola, NXP e ile ea bolella batseteli hore barekisi ba bang ba se ba ekelitse litheko mme k'hamphani e tla tlameha ho fetisa litšenyehelo tse ntseng li eketseha, e fana ka maikutlo a hore theko e tla nyoloha.Renesas e boetse e bolelletse bareki hore ba tla hloka ho amohela litheko tse holimo.

Joaloka moqapi e moholo ka ho fetisisa lefatšeng oa li- gate-programmable gate arrays (FPGAs), li-chips tsa Xilinx li bohlokoa bakeng sa bokamoso ba likoloi tse hokahaneng le tse itsamaisang le litsamaiso tse tsoetseng pele tsa ho khanna tse thusang.Li-chips tsa eona tse hlophisitsoeng li boetse li sebelisoa haholo ho lisathelaete, moralo oa li-chip, aerospace, li-server tsa setsi sa data, liteishene tsa motheo tsa 4G le 5G, hammoho le lik'homphieutha tsa maiketsetso le lifofane tsa ntoa tsa F-35 tse tsoetseng pele.

Peng o re li-chips tsohle tse tsoetseng pele tsa Xilinx li hlahisoa ke TSMC mme k'hamphani e tla tsoelapele ho sebetsa le TSMC ka lichifi ha feela TSMC e boloka boemo ba eona ba boetapele ba indasteri.Selemong se fetileng, TSMC e phatlalalitse leano la $ 12 bilione ea ho aha fektheri naheng ea Amerika ha naha e shebile ho khutlisetsa tlhahiso ea li-chips tsa sesole mobung oa US.Lihlahisoa tse seng li holile ho feta tsa Celerity li fanoa ke UMC le Samsung naheng ea Korea Boroa.

Peng o lumela hore indasteri eohle ea semiconductor e kanna ea hola ho feta ka 2021 ho feta ka 2020, empa ho qaleha hape ha seoa le khaello ea likarolo le tsona li baka ho hloka botsitso ka bokamoso ba eona.Ho latela tlaleho ea selemo le selemo ea Xilinx, China e nkile sebaka sa US joalo ka mmaraka oa eona o moholo ho tloha ka 2019, ka hoo e ka bang 29% ea khoebo ea eona.