Ho latela Reuters Hong Kong, China e sebetsa ho US $ 143.9 billion, e lekanang le RMB1,004.6 billion, e ka kengoang ts'ebetsong pele kotara ea pele ea 2023.
HONG KONG, la 13 Tšitoe (Reuters) - China e sebetsa molemong oa tšehetso ea li-yuan tse fetang 1 trillion ($ 143 billion) bakeng sa eona.indasteri ea semiconductor, mehloli e meraro e boletse.Ona ke mohato oa bohlokoa oa ho iphelisa le ho loantša matsapa a US a reretsoeng ho liehisa tsoelopele ea eona ea thekenoloji.
Mehloli ea litaba e re ena ke e 'ngoe ea lithuso tse kholo ka ho fetisisa tsa lichelete lilemong tse hlano tse tlang, haholo-holo ka mokhoa oa lithuso le likalimo tsa lekhetho.Boholo ba lithuso tsa lichelete li tla sebelisoa ho tšehetsa lik'hamphani tsa China ho reka lisebelisoa tsa semiconductor bakeng sa tlhahiso ea li-wafer.Ke hore, theko ea thepa ea semiconductor e tla khona ho fumana thuso ea 20% bakeng salitšenyehelo tsa ho reka.
Ho tlalehoa hore hang ha litaba li tsoa, lihlahisoa tsa semiconductor tsa Hong Kong li ile tsa tsoela pele ho phahama qetellong ea letsatsi: Hua Hong Semiconductor e ile ea phahama ho feta 12%, ea otla holimo e ncha morao tjena;Solomon Semiconductor e nyolohile ho feta 7%, SMIC e nyolohile ho feta 6%, mme Shanghai Fudan e nyolohile ho feta 3%.
Beijing e rera ho qala e 'ngoe ea mananeo a eona a kholo ka ho fetisisa a khothatso ea lichelete nakong ea lilemo tse hlano, haholo lithuso le likalimo tsa lekhetho, ho ts'ehetsa tlhahiso ea lapeng le mesebetsi ea lipatlisiso, mehloli e boletse.
Mehloli e 'meli, e buileng ka boitlamo ba ho se tsejoe, e boletse hore morero ona o tla kengoa ts'ebetsong hang ha kotara ea pele ea selemo se tlang hobane ba ne ba sa fuoa tumello ea lipuisano tsa boralitaba.
Ba re boholo ba lithuso tsa lichelete li tla sebelisoa ho tšehetsa lik'hamphani tsa China ho reka lisebelisoa tsa lapeng tsa semiconductor, haholo masela kapa masela a semiconductor.
Likhamphani li tla ba le tokelo ea ho fumana thuso ea liperesente tse 20 bakeng sa litšenyehelo tsa theko, mehloli e meraro e boletse.
Sephutheloana sa tšehetso ea lichelete se tla ka mor'a hoLefapha la Khoeboe fetisitse melao e akaretsang ka Mphalane e ka thibelang tšebeliso ea li-chips tsa AI tse tsoetseng pele lilaboratoring tsa lipatlisiso le litsing tsa data tsa khoebo.
Mopresidente oa Amerika Joe Biden o saenetse bili ea chip ka Phato e fanang ka lithuso tsa $ 52.7 billion bakeng sa tlhahiso ea semiconductor ea US le lipatlisiso le likalimo tsa lekhetho bakeng sa lifeme tsa chip tse hakanyetsoang ho $24 billion.
Ka lenaneo la khothatso, Beijing e tla eketsa tšehetso bakeng sa lik'hamphani tsa China tsa chip ho aha, ho holisa kapa ho ntlafatsa tlhahiso ea lapeng, kopano, ho paka le ho etsa lipatlisiso le nts'etsopele, mehloli e boletse.
Morero oa morao-rao oa Beijing o boetse o kenyelletsa likhothatso tsa lekhetho bakeng sa indasteri ea semiconductor ea China, ba boletse joalo.
Ofisi ea Litaba ea Lekhotla la Naha ea China ha ea ka ea araba hanghang kopo ea ho fana ka maikutlo.
Ba ka ruang molemo:
Bajalefa e tla ba libapali tsa mmuso le tsa poraefete lefapheng lena, haholo-holo lik'hamphani tse kholo tsa lisebelisoa tsa semiconductor tse kang NAURA Technology Group (002371.SZ) Advanced Micro-Fabrication Equipment Inc, mehloli e ekelitse China (688012.SS) le Kingsemi (688037). SS).
Ka mor'a litaba, lihlahisoa tse ling tsa China tsa Hong Kong li ile tsa phahama haholo.SMIC (0981.HK) e nyolohile ho feta liperesente tse 4, hoo e ka bang liperesente tse 6 ka letsatsi.Ho fihlela joale, likarolo tsa Hua Hong Semiconductor (1347. HK) li eketsehile ho feta liphesente tse 12 ha li-stock tsa naha li koetsoe qetellong.
Litlaleho tse 20 tse holimo li ile tsa akaretsa saense le thekenoloji ka makhetlo a 40, boqapi makhetlo a 51 le talenta makhetlo a 34.
Nako ea poso: Dec-30-2022