01 Nako ea ho fana ka Chip e fokotsehile, empa e ntse e nka libeke tse 24
Pherekhong 23, 2023 - Phepelo ea chip e ntse e eketseha, ka linako tse tloaelehileng tsa ho fana hona joale li ka bang libeke tse 24, libeke tse tharo li le khuts'oane ho feta rekoto ea Mots'eanong e phahameng empa e ntse e le kaholimo ho libeke tse 10 ho isa ho tse 15 pele ho koluoa, ho latela tlaleho e ncha e phatlalalitsoeng ke Susquehanna. Sehlopha sa lichelete.
Tlaleho e boetse e bolela hore linako tsa ho etella pele li fokotsehile likarolong tsohle tsa lihlahisoa tsa bohlokoa, ka li-IC tsa tsamaiso ea matla le li-chip tsa IC tsa analog tse bontšang ho fokotseha ho hoholo ha linako tsa ho etella pele.Nako ea ho etella pele ea Infineon e fokotsoe ka matsatsi a 23, TI ka libeke tse 4, le Microchip ka matsatsi a 24.
02 TI: e ntse e na le tšepo mabapi le 'maraka oa chip oa likoloi oa 1Q2023
La 27 Pherekhong 2023 - The analog le e kenyellelitsoeng chip moetsi oa Texas Instruments (TI) e bolela esale pele hore lekeno la eona le tla theoha e 'ngoe ho isa ho 8% ho isa ho 15% selemo le selemo kotareng ea pele ea 2023. Khamphani e bona "tlhokahalo e fokolang mebarakeng eohle ea pheletso. haese koloi” bakeng sa kotara.
Ka mantsoe a mang, bakeng sa TI, ka 2023, ha baetsi ba likoloi ba kenya li-analog tse ngata le li-chips tse kentsoeng likoloing tsa bona tsa motlakase, khoebo ea chip ea likoloi ea k'hamphani e ka lula e tsitsitse, likhoebo tse ling, joalo ka li-smartphones, likhokahano le litsamaiso tsa khoebo li rekisoa kapa li lula li le tlase.
03 ST e lebeletse kholo e fokolang ka 2023, e boloka litšenyehelo tsa lichelete
Har'a kholo e ntseng e tsoela pele ea meputso le bokhoni ba ho rekisoa, Mopresidente oa ST le CEO Jean-Marc Chery o ntse a tsoela pele ho bona ho fokotseha ha kholo ea indasteri ea semiconductor ka 2023.
Phatlalatsong ea eona ea morao-rao ea meputso, ST e tlalehile chelete e kenang ea kotara ea bone ea $ 4.42 bilione le phaello ea $ 1.25 bilione, ka chelete ea selemo eohle e fetang $ 16 bilione.Khamphani e boetse e ekelitse litšenyehelo tsa chelete ka thepa ea eona ea limilimithara tse 300 e Crolles, Fora, le lesela la eona la silicon carbide wafer le lesela la substrate Catania, Italy.
Lichelete li eketsehile ka 26.4% ho isa ho $ 16.13 bilione ka lichelete tsa 2022, ka lebaka la tlhoko e matla e tsoang makaleng a likoloi le a indasteri, "ho boletse Jean-Marc Chery, mopresidente le CEO oa STMicroelectronics."Re sebelisitse $ 3.52 bilione ts'ebelisong ea chelete ha re ntse re hlahisa $ 1.59 bilione ho phallo ea chelete ea mahala.Maikutlo a rona a khoebo ea nako e mahareng bakeng sa kotara ea pele ke chelete e kenang ea liranta tse libilione tse 4.2, ho nyoloha ka liperesente tse 18.5 selemo le selemo le ho theoha ka liperesente tse 5.1 ka tatellano.
O itse: 'Ka 2023, re tla khanna chelete ea chelete ho $ 16.8 limilione tse likete ho ea ho $ 17.8 limilione tse likete, keketseho ea 4 ho ea ho 10 lekholong ho feta 2022.''Likoloi le liindasteri e tla ba tsona tse ka sehloohong tsa ho hōla,' me re rerile ho tsetela liranta tse limilione tse likete tse 4, karolo ea 80 ea eona e le bakeng sa kholo ea 300mm ea masela le SiC, ho kenyelletsa le mehato ea substrate, le karolo ea 20 e setseng bakeng sa R & D le labs.'
Chery o itse, "Ho hlakile hore libaka tsohle tse amanang le indasteri ea likoloi le B2B (ho kenyeletsoa lisebelisoa tsa motlakase le li-microcontrollers tsa likoloi) li bolokiloe ka botlalo molemong oa rona selemong sena."
Litaba tsa feme ea mantlha: Sony, Intel, ADI
04 Omdia: Sony e na le 51.6% ea 'maraka oa CIS
Haufinyane tjena, ho latela boemo ba Omdia ba 'maraka oa lefats'e oa sensor ea setšoantšo sa CMOS, thekiso ea sensor ea litšoantšo ea Sony e fihlile ho $2.442 bilione karolong ea boraro ea 2022, e leng karolo ea 51.6% ea karolo ea mmaraka, e ntse e atolosa lekhalo le Samsung ea boemo ba bobeli, e neng e ikarabella bakeng sa 15.6%.
Sebaka sa boraro ho isa ho sa bohlano ke OmniVision, onsemi, le GalaxyCore, ka likarolo tsa 'maraka tsa 9.7%, 7%, le 4%, ka ho latellana.Thekiso ea Samsung e fihlile ho $ 740 milione karolong ea boraro ea selemo se fetileng, ho tloha ho $ 800 milione ho ea ho $ 900 milione libakeng tse fetileng, ha Sony e ntse e tsoela pele ho fumana karolo ea 'maraka e tsamaisoang ke litaelo tsa li-smartphone tse kang Xiaomi Mi 12S Ultra.
Ka 2021, karolo ea mmaraka ea Samsung ea CIS e fihla ho 29% le Sony's 46%.Ka 2022, Sony e ile ea eketsa lekhalo ka sebaka sa bobeli.Omdia o lumela hore mokhoa ona o tla tsoela pele, haholo-holo ka Sony CIS e tlang bakeng sa letoto la Apple la iPhone 15, le lebelletsoeng ho holisa moetapele.
05 Intel: lethathamo la bareki le hlakileng le bonoang selemong se fetileng, ho boletse esale pele 1Q23 tahlehelo e tsoelang pele
Haufinyane tjena, Intel (Intel) e phatlalalitse moputso oa eona oa 4Q2022, ka lekeno la lidolara tse limilione tse likete tse 14, tlase e ncha ka 2016, le tahlehelo ea $ 664 milione, phokotso ea 32% ea phaello ka nako e ts'oanang selemong se fetileng.
Pat Gelsinger, CEO, o lebelletse hore ho putlama ho tla tsoela pele halofong ea pele ea 2023, ka hona tahlehelo e lebelletsoe ho tsoela pele kotareng ea pele.Lilemong tse 30 tse fetileng, Intel ha e so ka e ba le likarolo tse peli tse latellanang tsa tahlehelo.
Ho latela Bloomberg, sehlopha sa khoebo se ikarabellang bakeng sa li-CPU se theohile ho 36% ho isa ho $ 6.6 bilione kotareng ea bone.Intel e lebelletse hore thomello ea PC selemong sena e fihle ho li-unit tse limilione tse 270 ho isa ho li-unit tse limilione tse 295 tsa letšoao le tlase.
Khamphani e lebelletse hore tlhoko ea seva e tla fokotseha kotareng ea pele ebe e khutla hape kamora moo.
Motsamaisi oa Intel, Pat Gelsinger, o amohetse hore karolo ea mmaraka ea setsi sa data e ntse e tsoela pele ho senyeha ke mohanyetsi oa Supermicro (AMD).
Gelsinger o boetse a bolela esale pele hore ketso ea tumello ea thepa ea bareki e ntse e tsoela pele, leqhubu lena la tumello ea thepa joalo ka ha le bone selemong se fetileng, kahoo Intel le eona e tla ameha haholo kotareng ea pele.
06 Bakeng sa Liindasteri le Likoloi, ADI E Eketsa Bokhoni ba Analog IC
Haufinyane tjena, ho ile ha tlalehoa hore ADI e sebelisa $ 1 limilione tse likete ho ntlafatsa semela sa eona sa semiconductor haufi le Beaverton, Oregon, USA, e tla eketsa matla a eona a tlhahiso habeli.
Re etsa matsete a bohlokoa ho ntlafatsa sebaka sa rona sa tlhahiso, ho hlophisa bocha lisebelisoa ho eketsa tlhahiso, le ho holisa meaho ea rona ka kakaretso ka ho eketsa sebaka sa lisekoere-mithara tse 25,000 tsa sebaka se eketsehileng sa bohloeki, "ho boletse Fred Bailey, motlatsi oa mopresidente oa ts'ebetso ea limela ho ADI.
Tlaleho e hlokometse hore semela sena haholo-holo se hlahisa litsupa tsa analoge tsa boemo bo holimo tse ka sebelisoang bakeng sa taolo ea mohloli oa mocheso le taolo ea mocheso.Limmaraka tse shebiloeng li haholo-holo makaleng a indasteri le a makoloi.Sena se ka qoba tšusumetso ho isa bohōleng bo itseng tlhokahalong e fokolang ea 'maraka oa lisebelisoa tsa elektroniki tsa bareki.
Theknoloji e Ncha ea Sehlahisoa: DRAM, SiC, Server
07 SK Hynix e Tsebahatsa Mohala o potlakileng ka ho Fetisisa oa Indasteri oa DRAM LPDDR5T
La 26 Pherekhong 2023 - SK Hynix e phatlalalitse nts'etsopele ea mohala o potlakileng ka ho fetisisa lefatšeng oa DRAM, LPDDR5T (Low Power Double Data Rate 5 Turbo), le ho fumaneha ha lihlahisoa tsa mohlala ho bareki.
Sehlahisoa se secha, LPDDR5T, se na le tekanyo ea data ea 9.6 gigabits ka motsotsoana (Gbps), e leng karolo ea 13 lekholong ka potlako ho feta moloko o fetileng oa LPDDR5X, o tla hlahisoa ka November 2022. Ho totobatsa litšobotsi tse phahameng tsa lebelo la sehlahisoa, SK Hynix e kentse "Turbo" ho fihlela qetellong ea lebitso le tloaelehileng LPDDR5.
Ka keketseho e tsoelang pele ea 'maraka oa li-smartphone tsa 5G, indasteri ea IT e bolela esale pele keketseho ea tlhokahalo ea li-memory chips tse phahameng haholo.Ka mokhoa ona, SK Hynix e lebelletse hore lits'ebetso tsa LPDDR5T li tla hola ho tloha ho li-smartphones ho ea ho bohlale ba maiketsetso (AI), ho ithuta ka mochini, le 'nete e ntseng e eketseha / ea nnete (AR/VR).
08. ON balekane ba Semiconductor le VW ho tsepamisa maikutlo ho theknoloji ea SiC bakeng sa likoloi tsa motlakase.
Jan. 28, 2023 - ON Semiconductor (onsemi) e sa tsoa phatlalatsa hore e saenetse tumellano ea leano le Volkswagen Jeremane (VW) ho fana ka li-module le li-semiconductors ho nolofalletsa tharollo e feletseng ea koloi ea motlakase (EV) traction inverter bakeng sa lelapa la sethaleng se latelang sa VW. .Semiconductor ke karolo ea ntlafatso ea sistimi ka kakaretso, e fana ka tharollo ea ho ts'ehetsa li-inverters tse ka pele le tse ka morao bakeng sa mefuta ea VW.
E le karolo ea tumellano, onyomi e tla fana ka li-module tsa motlakase oa EliteSiC 1200V traction inverter e le mohato oa pele.Li-module tsa matla tsa EliteSiC lia lumellana, 'me li lumella ho lekanya tharollo ho maemo a fapaneng a matla le mefuta ea li-motor.Lihlopha tse tsoang lik'hamphaning ka bobeli li 'nile tsa sebetsa 'moho nako e fetang selemo ho ntlafatsa li-module tsa motlakase bakeng sa sethala sa moloko o latelang, 'me lisampole tsa pele ho tlhahiso li ntse li ntlafatsoa le ho hlahlojoa.
09 Rapidus e rera ho lekola tlhahiso ea lichifi tsa 2nm ho tloha ka 2025
Jan. 26, 2023 - Khamphani ea Japane ea semiconductor ea Rapidus e rera ho theha mohala oa tlhahiso ea lifofane ho tloha halofo ea pele ea 2025 le ho e sebelisa ho hlahisa 2nm semiconductor chips bakeng sa li-supercomputers le lisebelisoa tse ling, le ho qala tlhahiso ea bongata pakeng tsa 2025 le 2030, Nikkei. Asia e tlalehile.
Rapidus e ikemiselitse ho hlahisa ka bongata 2nm mme hajoale e ntse e tsoela pele ho 3nm bakeng sa tlhahiso ea bongata.Morero ke ho theha mela ea tlhahiso ho elella bofelong ba lilemo tsa bo-2020 le ho qala ho etsa li-semiconductors ho pota 2030.
Tlaleho e bontša hore Japane e ka hlahisa li-chips tsa 40nm hajoale, 'me Rapidus e thehiloe ho ntlafatsa boemo ba tlhahiso ea semiconductor Japane.
Nako ea poso: Feb-03-2023