Litaba tsa la 9 November ka 2021, CEO oa Intel Kissinger (Pat Gelsinger) o ile a qala leano la IDM2.0 la ho bula khoebo ea ho qala, o thehile karohano ea litšebeletso tsa motheo (IFS), ka tšepo ea ho sebelisa masela a eona ho theknoloji e tsoetseng pele ea theknoloji bakeng sa lik'hamphani tsa IC tsa meralo ntle le lisebelisoa tsa masela. tlhahiso ea lichifi, le ho feta le baetapele ba hajoale ba indasteri TSMC, Samsung Samsung.Tabeng ena, CEO oa Intel Henry Kissinger le eena o hlalositse haholo nakong e fetileng.Matsatsi a 'maloa a fetileng, o hlalositse kamoo Intel's IFS e fapaneng le bahlolisani ba eona.
Ho ea ka litlaleho tsa mecha ea litaba ea kantle ho naha, Kissinger o itse Intel's IFS e tla tlisa nako ea ho theha tsamaiso ea tsamaiso, ho fapana le mokhoa oa setso oa ho fana ka li-wafers ho bareki feela, Intel IFS e tla fana ka lihlahisoa le mahlale a kang li-wafers, liphutheloana, software le ho shoa.Motheo oa boemo ba sistimi ea Intel IFS e emela phetoho ea mokhoa ho tloha ho system-on-a-chip ho ea ho sistimi ka har'a sephutheloana, e kenyelletsang ts'ebeletso bakeng sa bareki ba kantle, hammoho le tlhahiso ea konteraka bakeng sa sehlahisoa se felletseng sa ka hare sa Intel, seo hape se bitsoang ke Kissinger Intel. Leano la IDM 2.0 mokhahlelo o mocha.
Litlhaloso tsa "Chips".
Intel e tla qala ka lintlha tse 'ne tsa bohlokoa tsa ho etsa li-wafer, ho paka tse tsoetseng pele, li-cores, le software,' me e ikarole ho bahlolisani ba bang libakeng tse 'ne tsa bohlokoa ho tsoela pele ho matlafatsa boiphihlelo ba eona ba moralo oa li-wafer le ho etsa le ho tsamaisa ho phahama ha Intel Foundry Services.
Nako ea poso: Nov-19-2022