Sehlopha sa Yole le ATREG kajeno li lekola matlotlo a indasteri ea semiconductor ea lefats'e ho fihlela joale le ho buisana ka hore na libapali tse kholo li hloka ho tsetela joang ho boloka liketane tsa bona tsa phepelo le bokhoni ba chip.
Lilemong tse hlano tse fetileng ho bile le liphetoho tse kholo indastering ea tlhahiso ea li-chip, joalo ka Intel e lahleheloa ke moqhaka ho bahlolisani ba babeli ba bacha, Samsung le TSMC.Mohlahlobi e Moholo oa Bohlale Pierre Cambou o bile le monyetla oa ho buisana ka boemo ba hajoale ba indasteri ea semiconductor ea lefats'e le kholo ea eona.
Puisanong e pharalletseng, ba ile ba bua ka 'maraka le menyetla ea kholo ea ona, hammoho le tikoloho ea lefats'e le hore na lik'hamphani li ka ntlafatsa phepelo joang.Tlhahlobo ea matsete a morao-rao indastering le maano a libapali tsa indasteri tse etelletseng pele li totobatsoa, hammoho le puisano ea kamoo lik'hamphani tsa semiconductor li matlafatsang liketane tsa bona tsa phepelo ea lefats'e.
Matsete a Lefatše
Mmaraka o felletseng oa lefats'e oa semiconductor o hola ho tloha ho boleng ba lidolara tse libilione tse 850 ka 2021 ho isa ho $913 billion ka 2022.
United States e boloka karolo ea 41% ea 'maraka;
Taiwan, China e hola ho tloha ho 15% ka 2021 ho isa ho 17% ka 2022;
Korea Boroa e theohile ho tloha ho 17% ka 2021 ho ea ho 13% ka 2022;
Japane le Europe li lula li sa fetohe - 11% le 9%, ka ho latellana;
China e nyoloha ho tloha ho 4% ka 2021 ho isa ho 5% ka 2022.
Mmaraka oa lisebelisoa tsa semiconductor o hola ho tloha ho US $555 billion ka 2021 ho isa ho US $573 billion ka 2022.
Karolo ea 'maraka ea Amerika e hola ho tloha ho 51% ka 2021 ho isa ho 53% ka 2022;
Korea Boroa e fokotseha ho tloha ho 22% ka 2021 ho ea ho 18% ka 2022;
Kabelo ea 'maraka ea Japane e eketsehile ho tloha ho 8% ka 2021 ho ea ho 9% ka 2022;
China e eketseha ho tloha ho 5% ka 2021 ho isa ho 6% ka 2022;
Taiwan le Europe li lula li sa fetohe ho 5% le 9% ka ho latellana.
Leha ho le joalo, kholo ea karolo ea 'maraka ea lik'hamphani tsa lisebelisoa tsa semiconductor tsa US e ntse e fokotseha butle-butle, ha boleng ba lefats'e bo eketsoa bo theoha ho 32% ka 2022. Ho sa le joalo, naha ea Chaena e behile merero ea kholo ea bohlokoa ea liranta tse limilione tse likete tse 143 ka 2025.
Molao oa US le EU CHIPS
The US Chip and Science Act, e fetisitsoeng ka Phato 2022, e ne e tla fana ka $ 53 bilione ka ho khetheha bakeng sa li-semiconductors ho matlafatsa lipatlisiso le tlhahiso ea malapeng.
Molao oa morao-rao oa European Union (EU) CHIPS Act, o voutetsoeng ka April 2023, o fana ka $47 bilione ea lichelete tseo, hammoho le kabo ea US, e ka fanang ka $100 billion transatlantic programme, 53/47% US/EU.
Lilemong tse peli tse fetileng, baetsi ba li-chip ho pota lefatše ba ntse ba etsa liphatlalatso tsa rekoto ea matsete a majabajaba ho hohela lichelete tsa CHIPS Act.K'hamphani e ncha ea Amerika ea Wolfspeed e phatlalalitse matsete a $ 5 bilione ho semela sa eona sa 200mm silicon carbide (SiC) pelong ea Massinami haufi le Utica, New York, e qalang tlhahiso ka Mmesa 2022. Intel, TSMC, IBM, Samsung, Micron Technology le Texas. Lisebelisoa li boetse li qalile ho seo ATREG e se hlalosang e le katoloso e matla ea masela molemong oa ho fumana sekhechana sa phae ea lichelete tsa US chip bill.
Likhamphani tsa US li etsa karolo ea 60% ea matsete a naha ho li-semiconductors.
Matsete a tsoang kantle ho naha (DFI) a ikarabella bakeng sa ba bang kaofela, ho boletse Pierre Kambou, mohlahlobi ea ka sehloohong ho Yole Intelligence.Matsete a TSMC a limilione tse likete tse 40 molemong oa kaho ea masela ho la Arizona ke e 'ngoe ea bohlokoa ka ho fetisisa, e lateloa ke Samsung (liranta tse limilione tse likete tse 25), SK Hynix (liranta tse limilione tse likete tse 15), NXP (liranta tse limilione tse likete tse 2.6), Bosch (liranta tse limilione tse likete tse 1.5) le X-Fab (liranta tse limilione tse 200) .
'Muso oa Amerika ha o ikemiselitse ho tšehetsa morero ona kaofela, empa o tla fana ka thuso e lekanang le 5% ho isa ho 15% ea litšenyehelo tsa lichelete tsa morero oa khampani, ka lichelete tse sa lebelloang ho feta 35% ea litšenyehelo.Likhamphani le tsona li ka etsa kopo ea litefiso tsa lekhetho ho khutlisa 25% ea litšenyehelo tsa kaho ea projeke."Ho fihlela joale, linaha tse 20 tsa Amerika li entse matsete a poraefete a fetang $210 bilione ho tloha ha Molao oa CHIPS o saena hore e be molao," Rothrock o hlokometse."Pitso ea pele ea lichelete tsa kopo ea CHIPS Act e qala bofelong ba Hlakola 2023 bakeng sa merero ea ho aha, ho holisa kapa ho nchafatsa meaho ea khoebo bakeng sa tlhahiso ea li-semiconductors tse tsoetseng pele, tsa morao-rao le tse hōlileng tsebong, ho kenyeletsoa le semiconductors se ka pele. lihlahisoa le lihlahisoa tsa morao-rao tsa ho paka."
"EU, Intel e rera ho haha lesela la liranta tse limilione tse likete tse 20 Magdeburg, Jeremane, le setsi sa $ 5 limilione tse likete tsa ho paka le ho hlahloba Poland. Tšebelisano pakeng tsa STMicroelectronics le GlobalFoundries e tla boela e bone letsete la $ 7 limilione tse likete ho lesela le lecha Fora. Ho phaella moo, TSMC, Bosch, NXP le Infineon li buisana ka tšebelisano ea liranta tse limilione tse likete tse 11. "Cambou e kentse.
IDM e boetse e tsetela Europe mme Infineon Technologies e thakgotse projeke ya $5 bilione Dresden, Germany."Lik'hamphani tsa EU li ikarabella bakeng sa 15% ea lichelete tse phatlalalitsoeng ka har'a EU. DFI e etsa 85%, "ho boletse Cambou.
Ha a nahana ka liphatlalatso tse tsoang Korea Boroa le Taiwan, Cambou o ile a etsa qeto ea hore US e tla fumana 26% ea chelete eohle ea lichelete tsa lefats'e tsa semiconductor le EU 8%, a hlokomela hore sena se lumella US ho laola phepelo ea eona, empa e haelloa ke sepheo sa EU. ea ho laola 20% ea matla a lefats'e ka 2030.
Nako ea poso: Jul-09-2023