Likaroloana tsa Elektronike IC Chips Lipotoloho Tse Kopantsoeng XC5VFX100T-1FFG1136I IC FPGA 640 I/O 1136FCBGA
Litšobotsi tsa Sehlahisoa
MOFUTA | TLHALOSO |
Sehlopha | Lipotoloho tse Kopantsoeng (ICs)E kenyelelitsoeFPGAs (Field Programmable Gate Array) |
Mfr | AMD Xilinx |
Letoto | Virtex®-5 FXT |
Sephutheloana | Terei |
Sephutheloana se Tloaelehileng | 1 |
Boemo ba Sehlahiswa | E sebetsa |
Palo ea li-LAB/CLBs | 8000 |
Palo ea Lintlha tsa Logic / Lisele | 102400 |
Kakaretso ea RAM Bits | 8404992 |
Nomoro ea I/O | 640 |
Voltage - Phepelo | 0.95V ~ 1.05V |
Mofuta oa ho Beha | Thaba e kaholimo |
Mocheso oa ho sebetsa | -40°C ~ 100°C (TJ) |
Sephutheloana / Taba | 1136-BBGA, FCBGA |
Sephutheloana sa Sesebelisoa sa Bafani | 1136-FCBGA (35×35) |
Nomoro ea Sehlahisoa sa Motheo | XC5VFX100 |
Xilinx: Mathata a phepelo ea chip ea likoloi ha se feela ka li-semiconductors
Ho ea ka litlaleho tsa mecha ea litaba, US chipmaker Xilinx o lemositse hore mathata a phepelo a amang indasteri ea likoloi a ke ke a rarolloa haufinyane le hore ha e sa le taba ea tlhahiso ea semiconductor empa hape e kenyelletsa bafani ba bang ba thepa le likarolo.
Victor Peng, mopresidente, le CEO oa Xilinx o itse puisanong: "Ha se li-wafers tsa motheo feela tse nang le mathata, li-substrates tse kenyang li-chips le tsona li tobane le mathata.Hona joale ho na le mathata le likarolo tse ling tse ikemetseng. ”Ceres ke morekisi ea ka sehloohong ho baetsi ba likoloi ba kang Subaru le Daimler.
Peng a re o na le tšepo ea hore khaello ena e ke ke ea nka selemo kaofela mme Ceres e leka ka hohle ho khotsofatsa tlhoko ea bareki."Re buisana le bareki ba rona ho utloisisa litlhoko tsa bona.Ke nahana hore re etsa mosebetsi o motle oa ho fihlela litlhoko tsa bona tse tlang pele.Ceres e boetse e sebetsa haufi-ufi le barekisi ho rarolla mathata, ho kenyeletsoa le TSMC. ”
Baetsi ba likoloi tsa lefats'e ba tobane le mathata a maholo tlhahisong ka lebaka la khaello ea li-cores.Hangata li-chips li fanoa ke lik'hamphani tse kang NXP, Infineon, Renesas, le STMicroelectronics.
Ho etsa li-chip ho kenyelletsa ketane e telele ea phepelo, ho tloha ho moralo le tlhahiso ho isa ho ho paka le ho etsa liteko, 'me qetellong ho isoa lifemeng tsa makoloi.Le ha indasteri e amohetse hore ho na le khaello ea li-chips, mathata a mang a qala ho hlaha.
Lisebelisoa tsa substrate tse kang ABF (Ajinomoto build-up film) substrates, tse bohlokoa bakeng sa ho paka li-chips tse phahameng tse sebelisoang likoloing, li-server le liteishene tsa motheo, ho thoe li tobane le khaello.Batho ba 'maloa ba tloaelaneng le boemo bona ba re nako ea ho fana ka substrate ea ABF e ekelitsoe ho feta libeke tse 30.
Mookameli oa chip supply chain o itse: "Li-chips tsa bohlale ba maiketsetso le likhokahano tsa 5G li hloka ho ja ABF e ngata, 'me tlhokahalo libakeng tsena e se e le matla haholo.Keketseho ea tlhokeho ea lichifi tsa likoloi e tiisitse phepelo ea ABF.Barekisi ba ABF ba ntse ba eketsa bokhoni, empa ba ntse ba sa khone ho fihlela tlhokahalo. ”
Peng o re leha ho na le khaello ea phepelo e sa lebelloang, Ceres e ke ke ea phahamisa litheko tsa li-chip le lithaka tsa eona ka nako ena.Ka Tšitoe selemong se fetileng, STMicroelectronics e tsebisitse bareki hore e tla eketsa litheko ho tloha ka Pherekhong, e re "keketseho ea tlhokeho ka mor'a hore lehlabula e be ka tšohanyetso mme lebelo la ho khutla le behile ketane eohle ea phepelo tlas'a khatello."Ka la 2 Hlakola, NXP e ile ea bolella batseteli hore barekisi ba bang ba se ba ekelitse litheko mme k'hamphani e tla tlameha ho fetisa litšenyehelo tse ntseng li eketseha, e fana ka maikutlo a hore theko e tla nyoloha.Renesas e boetse e bolelletse bareki hore ba tla hloka ho amohela litheko tse holimo.
Joaloka moqapi e moholo ka ho fetisisa lefatšeng oa li-gate arrays (FPGAs), li-chips tsa Ceres li bohlokoa bakeng sa bokamoso ba likoloi tse hokahaneng le tse itsamaisang le lits'ebetso tse tsoetseng pele tsa ho khanna.Li-chips tsa eona tse hlophisitsoeng li boetse li sebelisoa haholo ho lisathelaete, moralo oa li-chip, aerospace, li-server tsa setsi sa data, liteishene tsa motheo tsa 4G le 5G, hammoho le lik'homphieutha tsa maiketsetso le lifofane tsa ntoa tsa F-35 tse tsoetseng pele.
Peng o re li-chips tsohle tse tsoetseng pele tsa Ceres li hlahisoa ke TSMC mme k'hamphani e tla tsoelapele ho sebetsa le TSMC ka lichifi ha feela TSMC e boloka boemo ba eona ba boetapele ba indasteri.Selemong se fetileng, TSMC e phatlalalitse leano la $ 12 bilione ea ho aha fektheri naheng ea Amerika ha naha e shebile ho khutlisetsa tlhahiso ea li-chips tsa sesole mobung oa US.Lihlahisoa tse seng li holile ho feta tsa Celerity li fanoa ke UMC le Samsung naheng ea Korea Boroa.
Peng o lumela hore indasteri eohle ea semiconductor e kanna ea hola ho feta ka 2021 ho feta ka 2020, empa ho qaleha hape ha seoa le khaello ea likarolo le tsona li baka ho hloka botsitso ka bokamoso ba eona.Ho latela tlaleho ea selemo le selemo ea Ceres, China e nkile sebaka sa US joalo ka mmaraka oa eona o moholo ho tloha ka 2019, ka hoo e ka bang 29% ea khoebo ea eona.